Apparatus for temporary thermal coupling of an electronic device to a heat sink during test

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7332927
APP PUB NO 20070285116A1
SERIAL NO

11743899

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY48113

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aube, Paul J Charlotte, VT 2 15
Cote, Normand Quebec, CA 4 27
Gamache, Jr Roger G Essex Junction, VT 2 9
Gardell, David L Fairfax, VT 37 347
Gaschke, Paul M Wappingers Falls, NY 13 359
Knox, Marc D Hinesburg, VT 15 77
Turcotte, Denis D Quebec, CA 2 6

Cited Art Landscape

Patent Info (Count) # Cites Year
 
STOVOKOR TECHNOLOGY LLC (1)
5170930 Liquid metal paste for thermal and electrical connections 91 1991
 
Dennison Manufacturing Company (1)
4548857 Heat transferable laminate 91 1984
 
Delta Design, Inc. (2)
5864176 Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces 22 1997
5918665 Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested 27 1998
 
MONSANTO COMPANY (1)
4323533 Rotary forming of articles 30 1980
 
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (1)
4567505 Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like 161 1983
 
MG TECHNOLOGIES AG (1)
7038065 Process for catalytically producing organic substances by partial oxidation 3 2001
 
Mobil Oil Corporation (1)
5053434 Diamondoid polymeric compositions 30 1990
 
BASF AKTIENGESELLSCHAFT (1)
4507274 Desulfurization of H.sub.2 S-containing gases 13 1983
 
HENKEL IP & HOLDING GMBH (1)
6624224 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters 12 2000
* Cited By Examiner

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