Apparatus for temporary thermal coupling of an electronic device to a heat sink during test

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7332927
APP PUB NO 20070285116A1
SERIAL NO

11743899

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Abstract

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A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK NY 10504

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aube, Paul J Charlotte, VT 2 18
Cote, Normand Quebec, CA 4 31
Gamache, Jr Roger G Essex Junction, VT 2 11
Gardell, David L Fairfax, VT 39 367
Gaschke, Paul M Wappingers Falls, NY 13 371
Knox, Marc D Hinesburg, VT 18 87
Turcotte, Denis D Quebec, CA 2 7

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