Optimization of die placement on wafers
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United States of America Patent
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Feb 19, 2008
Grant Date -
N/A
app pub date -
Nov 22, 2004
filing date -
May 10, 2002
priority date (Note) -
Expired
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Abstract
A method of optimizing production of semiconductor devices on a wafer comprises steps of characterizing at least one effect of at least one manufacturing component on at least one optimization criterion; inputting user optimization data; and, based on the at least one effect and the user optimization data, performing optimization to determine a layout of semiconductor devices on the wafer that optimizes performance according to the user optimization data.
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