Method for protecting encapsulated sensor structures using stack packaging
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United States of America Patent
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Feb 26, 2008
Grant Date -
Oct 7, 2004
app pub date -
Mar 31, 2003
filing date -
Mar 31, 2003
priority date (Note) -
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Abstract
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
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