Microelectronic assembly having array including passive elements and interconnects
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United States of America Patent
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Feb 26, 2008
Issued Date -
N/A
app pub date -
Feb 22, 2005
filing date -
Oct 9, 2001
priority date (Note) -
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Abstract
A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are arranged in an array exposed at a major surface of the microelectronic element. One or more passive elements, e.g., a resistor, inductor, capacitor, or combination of the same are mounted to the microelectronic element, with an inner terminal of the passive element conductively mounted to an exposed surface of one contact and an outer terminal displaced vertically from the major surface of the microelectronic element.
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