Stack type surface acoustic wave package, and method for manufacturing the same
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United States of America Patent
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Feb 26, 2008
Issued Date -
N/A
app pub date -
Sep 2, 2005
filing date -
May 6, 2005
priority date (Note) -
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Abstract
A surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips.
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