Vapor HF etch process mask and method

United States of America Patent

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Mar 4, 2008
Grant Date
Oct 5, 2006
app pub date
Apr 4, 2006
filing date
Apr 5, 2005

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Abstract

A method of processing a semiconductor wafer provides a wafer, and then forms an organic mask on at least a portion of the wafer. The method then applies a vapor etching process to the wafer through holes in the organic mask.

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Patent Owner	Address
ANALOG DEVICES INC	ONE ANALOG WAY WILMINGTON MA 01887

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B44C:PRODUCING DECORATIVE EFFECTS

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Inventor Name	Address	# of filed Patents	Total Citations
Brosnihan, Timothy J	Natick, MA	37	1082
Martin, John R	Foxborough, MA	161	6994

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Vapor HF etch process mask and method

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United States of America Patent

11397409

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PATENT NO	7338614
APP PUB NO	20060223329A1
SERIAL NO	11397409
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 04, 2008	US,7338614,B2 US7338614B2	GRANTED PATENT AS SECOND PUBLICATION
October 05, 2006	US,20060223329,A1 US20060223329A1	FIRST PUBLISHED PATENT APPLICATION

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11397409

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