Resin-encapsulation semiconductor device and method for fabricating the same
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United States of America Patent
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Mar 4, 2008
Grant Date -
Aug 4, 2005
app pub date -
Mar 28, 2005
filing date -
Jul 23, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.
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