CVD diamond enhanced microprocessor cooling system
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United States of America Patent
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Mar 4, 2008
Grant Date -
Jun 3, 2004
app pub date -
Jan 18, 2002
filing date -
Jan 22, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.
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