Methods of packaging and testing microelectronic imaging devices
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United States of America Patent
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Mar 11, 2008
Grant Date -
Nov 16, 2006
app pub date -
Apr 24, 2006
filing date -
Aug 24, 2004
priority date (Note) -
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Abstract
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.
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