Metallic laminations for magnetic circuits
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United States of America Patent
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Mar 18, 2008
Grant Date -
Nov 17, 2005
app pub date -
Mar 21, 2005
filing date -
May 14, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Metallic laminations for magnetic circuits. Some of the illustrative embodiments may be a magnetic circuit comprising a low reluctance magnetic flux path comprising a plurality of stacked metallic laminations (each lamination having an edge), and an air gap in operational relationship to at least a portion of the edges of the stacked metallic laminations (wherein magnetic flux flows at least partially through the stacked metallic laminations and the air gap). Adjacent edges of the stacked metallic laminations are intentionally offset by an amount greater than manufacturing tolerance of edge position for the stacked metallic laminations to improve eddy current loss occurring from lamination-to-lamination contact at the edges.
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