Method and apparatus for characterizing microelectromechanical devices on wafers
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United States of America Patent
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Mar 18, 2008
Grant Date -
Dec 29, 2005
app pub date -
Jun 23, 2004
filing date -
Jun 23, 2004
priority date (Note) -
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Abstract
The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
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