Polyimide compositions having resistance to water sorption, and methods relating thereto
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United States of America Patent
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Mar 25, 2008
Grant Date -
Jul 14, 2005
app pub date -
Feb 19, 2004
filing date -
Jan 9, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250.degree. C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.
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