Method of forming a substantially closed void
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United States of America Patent
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Apr 1, 2008
Grant Date -
Feb 24, 2005
app pub date -
Aug 23, 2004
filing date -
Aug 22, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
To form a substantially closed void between two structures on a substrate, a flowable liquid dielectric material is deposited to fill partially the space between the structures, and a surface is placed to bridge and substantially close the space between the structures. The substrate is then inverted whilst maintaining the bridge and the deposited material is allowed to flow down to be substantially supported by the surface. The material is set in its substantially supported position, and the surface is removed.
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