Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
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United States of America Patent
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-
Apr 1, 2008
Grant Date -
Mar 2, 2006
app pub date -
Nov 29, 2004
filing date -
Aug 26, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
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