Methods and apparatuses for improved stabilization in a probing system
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United States of America Patent
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Apr 1, 2008
Grant Date -
Jul 19, 2007
app pub date -
Jan 18, 2006
filing date -
Jan 18, 2006
priority date (Note) -
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Abstract
Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
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