Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp

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United States of America Patent

PATENT NO 7352554
APP PUB NO 20060002052A1
SERIAL NO

10880895

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Abstract

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The present invention is directed to a J-R electrostatic clamp (ESC) and method for forming same. The ESC comprises a ceramic layer for clamping a wafer thereto, and a plurality of electrodes arranged across the ceramic layer in an interior region and a peripheral region of the backside surface, wherein a plurality of electrode groups are defined by electrodes in the interior regions and peripheral regions. A first insulating layer generally isolates the electrode groups from one another, and an interconnect layer comprising a plurality of electrically conductive vias and interconnects electrically connect the electrodes associated with each respective electrode group. Each electrode group comprises a connection node, wherein the respective electrode group is operable to connect to a respective voltage potential. A second insulating layer generally encapsulates the interconnect layer. The method comprises patterning the electrodes, first insulating layer, interconnect layer, and second insulating layer to form the ESC.

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Patent Owner(s)

Patent OwnerAddress
AXCELIS TECHNOLOGIES INC108 CHERRY HILL DRIVE BEVERLY MA 01915

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lagos, Bryan C Danvers, MA 7 261

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