Calibration of thermal sensors for semiconductor dies
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United States of America Patent
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Apr 8, 2008
Grant Date -
Mar 30, 2006
app pub date -
Sep 30, 2004
filing date -
Sep 30, 2004
priority date (Note) -
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Abstract
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
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