Eliminating printability of sub-resolution defects in imprint lithography
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United States of America Patent
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Apr 15, 2008
Grant Date -
Jun 1, 2006
app pub date -
Nov 30, 2005
filing date -
Dec 1, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a method of forming a desired pattern in a layer positioned on a substrate with a mold, the method including, inter alia, contacting the layer with the mold forming a shape therein having a plurality of features extending in a first direction; and altering dimensions of the shape of the layer in a second direction, orthogonal to the first direction, to eliminate a subset of the plurality of features having a dimension less that a predetermined magnitude while obtaining the desired pattern in the layer.
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