Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
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United States of America Patent
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Apr 22, 2008
Grant Date -
Dec 1, 2005
app pub date -
Jul 6, 2005
filing date -
Jun 23, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a --CH.sub.2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device. Also, disclosed is a positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a mixture solvent of two or more kinds (D), wherein the mixture solvent (D) contains .gamma.-butyrolactone and propylene glycol monoalkyl ether and the total amount of .gamma.-butyrolactone and propylene glycol monoalkyl ether is about 70 wt % or more of the total amount of solvent, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.
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