Stacked embedded leadframe
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United States of America Patent
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Apr 22, 2008
Grant Date -
N/A
app pub date -
Dec 7, 2005
filing date -
Nov 8, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the electronic component and partially encapsulating the leadframe; singulating each lead; forming via apertures through the substrate to expose the bond pads and the lower mounting portions; and filling the via apertures with an electrically conductive material to form vias electrically coupled to the bond pads and to the lower mounting portions. This permits stacking of electronic components in a small geometry.
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