Embedded capacitors and methods for their fabrication and connection
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United States of America Patent
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Apr 22, 2008
Grant Date -
Jun 21, 2007
app pub date -
Dec 21, 2005
filing date -
Dec 21, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
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