Molded high density electronic packaging structure for high performance applications
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United States of America Patent
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Apr 22, 2008
Grant Date -
Apr 27, 2006
app pub date -
Feb 3, 2004
filing date -
Feb 3, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
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