Three dimensional integrated circuits
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United States of America Patent
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Apr 22, 2008
Issued Date -
N/A
app pub date -
May 11, 2007
filing date -
Jul 8, 2002
priority date (Note) -
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Abstract
In a first aspect, a three-dimensional semiconductor device, wherein: a configurable memory element coupled to a programmable logic circuit to program the logic circuit is positioned substantially above the logic circuit. In a second aspect, a three-dimensional semiconductor device, comprising: a first module layer having a circuit block; and a second module layer positioned substantially above the first module layer, comprising a configuration circuit coupled to the circuit block to program the circuit block.
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