Polishing head for polishing semiconductor wafers
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United States of America Patent
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-
Apr 29, 2008
Grant Date -
Sep 6, 2007
app pub date -
Feb 28, 2007
filing date -
Mar 3, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
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