Rinsing processes and equipment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 29, 2008
Grant Date -
Nov 21, 2002
app pub date -
May 20, 2002
filing date -
May 30, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.
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