Method for cutting lead terminal of package type electronic component
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United States of America Patent
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Apr 29, 2008
Grant Date -
Jun 29, 2006
app pub date -
Oct 17, 2003
filing date -
Oct 17, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while leaving unnotched portions adjoining both ends of the main notch. Then, each lead terminal is cut at the main notch after molding the molded part, thereby making fewer and smaller cutting burrs occurring at the cut faces.
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