Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups
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United States of America Patent
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May 6, 2008
Grant Date -
Mar 2, 2006
app pub date -
Aug 18, 2005
filing date -
Aug 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.
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