RFID label technique
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United States of America Patent
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-
May 6, 2008
Grant Date -
Sep 28, 2006
app pub date -
May 16, 2006
filing date -
Jan 18, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.
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