System and method for protecting microelectromechanical systems array using back-plate with non-flat portion
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United States of America Patent
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May 6, 2008
Grant Date -
Mar 30, 2006
app pub date -
Mar 25, 2005
filing date -
Sep 27, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The depth of the gap may vary across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate may vary. The device may include reinforcing structures which are integrated with the back-plate.
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