Methods of making microelectronic assemblies including compliant interfaces
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United States of America Patent
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May 6, 2008
Grant Date -
Mar 9, 2006
app pub date -
Oct 26, 2005
filing date -
Sep 20, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
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