Methods and apparatuses for improved positioning in a probing system
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United States of America Patent
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May 6, 2008
Grant Date -
Jul 19, 2007
app pub date -
Jan 18, 2006
filing date -
Jan 18, 2006
priority date (Note) -
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Abstract
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
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