Method and apparatus for designing a pattern on a semiconductor surface

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United States of America Patent

PATENT NO 7370306
APP PUB NO 20050034092A1
SERIAL NO

10931361

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a surface of a semiconductor wafer. Identified problem structures or regions in a pattern of elements are moved from lower level cells of a hierarchy structure into higher level cells before edge movement takes place. Because all cells have been selectively leveled first, substantially all external influences to cells have been removed for each cell before edge movement takes place. The methods and procedures described herein therefore reduce the possibility of undesirable modifications such as electrical shorts. The methods and procedures described herein also reduce overall processing time.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Juengling, Werner Boise, ID 254 4667

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