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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT	100 WALL STREET SUITE 1600 NEW YORK NY 10005

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chew, Beng Chye	Singapore, SG	13	384
Lim, Thiam Chye	Singapore, SG	22	653
Neo, Chee Peng	Singapore, SG	19	401
Pour, Cheng Poh	Singapore, SG	13	391
Tan, Hock Chuan	Singapore, SG	16	399
Tan, Michael Kian Shing	Singapore, SG	12	384
Tan, Victor Cher Khng	Singapore, SG	15	578

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 13, 2008	US,7371608,B2   US7371608B2	GRANTED PATENT AS SECOND PUBLICATION
August 28, 2003	US,20030162325,A1   US20030162325A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7371608

Method of fabricating a stacked die having a recess in a die BGA package

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