Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
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United States of America Patent
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May 20, 2008
Grant Date -
N/A
app pub date -
Jun 28, 2004
filing date -
Jun 28, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.
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