Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 20, 2008
Grant Date -
Nov 4, 2004
app pub date -
Jan 27, 2004
filing date -
Jan 27, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be configured to transfer the objects to and/or from a single object carrier. Alternatively, each pivotable load-and-unload cup may be configured to transfer the objects to and/or from two object carriers. The pivotable load-and-unload cups may be configured to be pivoted about one or more pivoting points over at least one polishing surface, such as a polishing pad surface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully