Conductive polishing article for electrochemical mechanical polishing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 20, 2008
Grant Date -
Jul 15, 2004
app pub date -
Jun 26, 2003
filing date -
Feb 17, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
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