Light modulator with integrated drive and control circuitry
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United States of America Patent
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May 20, 2008
Grant Date -
N/A
app pub date -
Jun 21, 2006
filing date -
Mar 22, 2003
priority date (Note) -
Expired
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Abstract
Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.
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