Multiple wavelength sensor interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 27, 2008
Issued Date -
N/A
app pub date -
Mar 1, 2006
filing date -
Mar 1, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sensor interconnect assembly has a circuit substrate. An emitter portion of the substrate is adapted to mount emitters. A detector portion of the substrate is adapted to mount a detector. A cable portion of the substrate is adapted to connect a sensor cable. A first group of conductors are disposed on the substrate electrically interconnecting the emitter portion and the cable portion. A second group of conductors are disposed on the substrate electrically interconnecting the detector portion and the cable portion. A decoupling portion of the substrate disposed proximate the cable portion substantially mechanically isolating the cable portion from both the emitter portion and the detector portion so that sensor cable stiffness is not translated to the emitters or the detector.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully