Positive type photosensitive epoxy resin composition and printed circuit board using the same
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United States of America Patent
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-
May 27, 2008
Grant Date -
Oct 26, 2006
app pub date -
Jun 21, 2006
filing date -
Nov 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.
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Cited Art Landscape
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