Method and apparatus for decoupling conductive portions of a microelectronic device package
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United States of America Patent
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May 27, 2008
Grant Date -
Mar 8, 2007
app pub date -
Nov 10, 2006
filing date -
Aug 23, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have first and second neighboring conductive portions with at least a part of the first conductive portions spaced apart from a part of the neighboring second conductive portion to define an intermediate region between the first and second conductive portions. Each conductive portion has a bond region electrically coupled to the microelectronic substrate. A dielectric material is positioned adjacent to the first and second conductive portions in the intermediate region and has a dielectric constant of less than about 3.5.
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