Dual wafer pressure sensor

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United States of America Patent

PATENT NO 7380460
APP PUB NO 20070144266A1
SERIAL NO

11706305

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Abstract

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A pressure sensor (30) for sensing a fluid pressure in harsh environments such as the air pressure in a tire. The sensor has a dual wafer construction with a first wafer substrate (32) that has a cavity extending from its front side to the opposing back side. A flexible membrane (50) seals the cavity at the front side and a second wafer (31) seals the cavity at the back side of the first wafer (32) to form a chamber (58) containing a fluid at a reference pressure. The flexible membrane (50) deflects due to pressure differentials between the reference pressure and the fluid pressure and associated circuitry (34) for converts the deflection of the flexible membrane (50) into an output signal indicative of the fluid pressure. The second wafer (31) is wafer bonded to the first wafer substrate (32) as wafer bonding offers an effective non-adhesive solution. It provides a hermetic seal with only minor changes to the fabrication procedure. Skilled workers in this field will readily understand that the most prevalent forms of wafer bonding are:direct wafer, or silicon fusion, bonding;anodic, or electrostatic Mallory process bonding; and,intermediate layer bonding.

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Patent Owner(s)

Patent OwnerAddress
PRECISION MECHATRONICS PTY LTD44-48 WATERLOO RD NORTH RYDE 2113

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mallinson, Samuel George Balmain, AU 103 573
Silverbrook, Kia Balmain, AU 5829 91498

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