Method and apparatus for seaming abutting layers of planar material
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United States of America Patent
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Jun 3, 2008
Grant Date -
Mar 30, 2006
app pub date -
Nov 17, 2005
filing date -
Jan 21, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus is provided for seaming together abutting side-by-side layers of planar material with adhesive and a backing tape to form a finished seam extending along the line of abutment. The method consists of laying a backing tape underneath the line of abutment between adjacent layers of planar material, such as floor covering, followed by dispensing an adhesive through an applicator tip along the edges of the abutting layers while simultaneously centering the backing tape with the line of abutment with the applicator tip and dispensing adhesive though the applicator tip on top of the backing tape. The edges of the abutting layers are then pressed together and against the backing tape until the adhesive has at least partially set thereby forming a finished seam.
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