Integrated circuit system for bonding
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United States of America Patent
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Jun 3, 2008
Grant Date -
Oct 19, 2006
app pub date -
Apr 13, 2005
filing date -
Apr 13, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit system provides a precursor for an integrated wire bond and flip chip structure. The precursor has a plurality of contact pads thereon. A layer of titanium is deposited on the precursor. A layer of nickel-vanadium is deposited on the layer of titanium. A layer of copper is deposited on the layer of nickel-vanadium. A mask is formed on at least a portion of the layer of copper. Portions of the layers of copper and nickel-vanadium not protected by the mask are removed to expose portions of the layer of titanium. The exposed portions of the layer of titanium are etched with an etching solution consisting of an etchant, a viscosity modifier, and an oxidizer.
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