Characterization and reduction of variation for integrated circuits
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United States of America Patent
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Jun 3, 2008
Grant Date -
Jun 16, 2005
app pub date -
Dec 6, 2004
filing date -
Jun 7, 2002
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Abstract
A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.
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