Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 10, 2008
Grant Date -
Jul 7, 2005
app pub date -
Jun 30, 2004
filing date -
Sep 30, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
First Claim
Family
International Classification(s)
- No Non-US Classification to display
Cited Art Landscape
Patent Citation Ranking
- No Patent Citation Ranking to display
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully