Dicing saw with variable indexing capability

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United States of America Patent

PATENT NO 7387119
APP PUB NO 20050211236A1
SERIAL NO

11137048

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Abstract

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A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID 83716

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 801 30978
Gochnour, Derek J Boise, ID 52 1080
Hembree, David R Boise, ID 393 15928
Hess, Michael E Kuna, ID 36 736

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