Thin film with MEMS probe circuits and MEMS thin film probe head using the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7388388
APP PUB NO 20060145338A1
SERIAL NO

11320634

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Abstract

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A flexible one-piece thin film with microelectro-mechanical systems (MEMS) probe circuits has a flexible non-conducting dielectric layer made from polyimide or silica, various electrical circuits arranged in multi-layered structure all embedded inside the dielectric layer, plural probes and circuit contacts protected by the dielectric layer from damage by way of one end embedded into the dielectric layer in connection with the electrical circuits respectively and the other end protruded out of the dielectric layer, and a raised probe supported-spacer disposed on the dielectric layer to form a buffer to the probes to prevent the probe from being exposed to much pressure.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dong, Wen-Chang Banciao City, Taipei County, TW 7 26

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANTEST (SINGAPORE) PTE. LTD. (3)
* 6815961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 68 2002
* 7137830 Miniaturized contact spring 6 2003
* 7126358 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 9 2004
 
Bipolar Technologies, Inc. (1)
* 6610440 Microscopic batteries for MEMS systems 103 2000
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
* 5953306 Micro needle probe apparatus having probes cantilevered over respective electronic circuits, moving medium memory device including same and method of making same 33 1997
 
HUGHES ELECTRONICS CORPORATION (1)
* 6040611 Microelectromechanical device 36 1998
 
CABOT MICROELECTRONICS CORPORATION (1)
* 7317232 MEM switching device 4 2003
 
GLIMMERGLASS NETWORKS, INC. (1)
* 6791742 MEMS structure with raised electrodes 7 2003
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 6743656 MEMS wafer level package 48 2002
 
ADVANTEST CORPORATION (1)
* 7247035 Enhanced stress metal spring contactor 28 2004
 
U CHICAGO ARGONNE LLC (1)
* 6613601 Ultrananocrystalline diamond cantilever wide dynamic range acceleration/vibration/pressure sensor 14 2002
 
THE GEORGE WASHINGTON UNIVERSITY (1)
* 2003/0104,649 Method for making CMOS-based monolithic micro electromechanical system (MEMS) integrated circuits and integrated circuits made thereby 21 2002
 
WISPRY, INC. (1)
* 6917086 Trilayered beam MEMS device and related methods 46 2004
 
TOKYO INSTITUTE OF TECHNOLOGY (1)
* 6127765 Micro-electromechanical device 40 1999
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
NUVOTRONICS, INC. (4)
9583856 Batch fabricated microconnectors 0 2014
9515364 Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume 0 2014
9570789 Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof 0 2015
9608303 Multi-layer digital elliptic filter and method 0 2016
 
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (1)
* 9268161 Method for manufacturing a liquid crystal panel 0 2013
* Cited By Examiner

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