US Patent No: 7,388,388

Number of patents in Portfolio can not be more than 2000

Thin film with MEMS probe circuits and MEMS thin film probe head using the same

ALSO PUBLISHED AS: 20060145338

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Abstract

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A flexible one-piece thin film with microelectro-mechanical systems (MEMS) probe circuits has a flexible non-conducting dielectric layer made from polyimide or silica, various electrical circuits arranged in multi-layered structure all embedded inside the dielectric layer, plural probes and circuit contacts protected by the dielectric layer from damage by way of one end embedded into the dielectric layer in connection with the electrical circuits respectively and the other end protruded out of the dielectric layer, and a raised probe supported-spacer disposed on the dielectric layer to form a buffer to the probes to prevent the probe from being exposed to much pressure.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dong, Wen-Chang Banciao City, Taipei County, TW 7 10

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANTEST (SINGAPORE) PTE LTD (4)
6,815,961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 67 2002
7,137,830 Miniaturized contact spring 6 2003
7,247,035 Enhanced stress metal spring contactor 24 2004
7,126,358 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies 9 2004
 
Bipolar Technologies, Inc. (1)
6,610,440 Microscopic batteries for MEMS systems 86 2000
 
CABOT MICROELECTRONICS CORPORATION (1)
7,317,232 MEM switching device 3 2003
 
GLIMMERGLASS NETWORKS, INC. (1)
6,791,742 MEMS structure with raised electrodes 7 2003
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
5,953,306 Micro needle probe apparatus having probes cantilevered over respective electronic circuits, moving medium memory device including same and method of making same 32 1997
 
HUGHES ELECTRONICS CORPORATION (1)
6,040,611 Microelectromechanical device 35 1998
 
TEXAS INSTRUMENTS INCORPORATED (1)
6,743,656 MEMS wafer level package 44 2002
 
THE GEORGE WASHINGTON UNIVERSITY (1)
2003/0104,649 Method for making CMOS-based monolithic micro electromechanical system (MEMS) integrated circuits and integrated circuits made thereby 20 2002
 
TOKYO INSTITUTE OF TECHNOLOGY (1)
6,127,765 Micro-electromechanical device 40 1999
 
UCHICAGO ARGONNE, LLC (1)
6,613,601 Ultrananocrystalline diamond cantilever wide dynamic range acceleration/vibration/pressure sensor 11 2002
 
WISPRY, INC. (1)
6,917,086 Trilayered beam MEMS device and related methods 26 2004

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