Die design with integrated assembly aid
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United States of America Patent
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-
Jun 17, 2008
Grant Date -
Apr 10, 2008
app pub date -
Oct 15, 2007
filing date -
Nov 14, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An upper die portion of a die head for aligning probe pins in first array of first micro-holes formed in lower die portion of the die head, which generally includes a spacer portion and is adapted to contact lower die portion is typically positioned between second surface and support frame and includes a second array of second micro-holes adapted to receive probe pins generally is in contact or close proximity to first assembly aid film and has a third array of third micro-holes adapted to receive probe pins and third array of third micro-holes are patterned to align with one another but are both offset with first array of first micro-holes by approximately the lateral distance between probe tip and probe head.
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