Importance

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Abstract

A high fidelity 'loop-back' or interconnection of terminal pads of an IC on a wafer being tested in production is provided, while simultaneously a DC or low frequency path is provided back to a test system. Two or more IC pads are connected by probes forming the 'loop-back,' each probe forming an inductor, the probes being connected together through a trace in a substrate. A capacitor is then provided on a layer of the substrate connected to the trace to form a three-pole filter. To provide isolation of high frequency self-test signals between the probes and lower frequency signals of the test system, an inductor is placed in the path between the tester and probes. The inductor provides an 'AC' or high frequency block between the test system and probes, while still allowing the test system to use DC or low frequency signals to verify continuity, leakage, and perform other DC parametric tests.

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First Claim