Method and apparatus for inspecting pattern defects
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United States of America Patent
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Jun 17, 2008
Grant Date -
Jul 7, 2005
app pub date -
Nov 22, 2004
filing date -
Nov 20, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to a pattern defect inspection method and apparatus that reveal ultramicroscopic defects on an inspection target in which ultramicroscopic circuit patterns are formed, and inspect the defects with high sensitivity and at a high speed. The present invention provides a pattern inspection apparatus for comparing the images of corresponding areas of two formed patterns that should be identical with each other, and judging any mismatched image area as a defect. The pattern inspection apparatus includes means for performing an image comparison process on a plurality of areas in a parallel manner. Further, the pattern inspection apparatus also includes means for converting the gradation of the image signals of compared images in each of a plurality of different processes. Therefore, the present invention can properly detect defects even if the same patterns of compared images differ in brightness.
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